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STAMI Members and Chemistry & Biochemistry Professors Jean-Luc Bredas (COPE, GPTN) and Seth Marder (COPE, GTPN, CRĀSI) have H-index scores greater than 100, a singular feat that is achieved by few researchers.
Georgia Tech's Center for the Science and Technology of Advanced Materials and Interfaces (STAMI) held its 2018 STAMI Industrial Partners Day and Exposition on Sept. 27-28, 2018 at The Historic Academy of Medicine. The meeting featured talks from leaders in industry and academia, student presentations, and networking opportunities.
Soft Matter Incubator (SMI) member Saad Bhamla (School of Chemical and Biomolecular Engineering) has received a four-year National Science Foundation (NSF) grant to study Spirostomum ambiguum, a tiny single-celled protozoan that achieves blazing-fast acceleration while contracting its worm-like body. The physics and mathematics of the movement could help advance nanotechnology and accelerate a new generation of robots barely large enough to see with the naked eye. Read more in Research Horizons.
New materials developed in the labs of GTPN, CRĀSI, and SMI member Carson Meredith derived from crab shells and tree fibers has the potential to replace the flexible plastic packaging used to keep food fresh. GTPN, CRĀSI, and SMI members John Reynolds and Meisha Shofner were also part of the team.
The new material is described in the journal ACS Sustainable Chemistry and Engineering. See the Article in Research Horizons.
COPE, GTPN, and CRĀSI Professors Seth Marder, Zhiqun Lin, Natalie Stingelin, and Carlos Silva from the Schools of Chemistry and Biochemistry and Materials Sciences and Engineering have received a Defense University Research Instrumentation Program (DURIP) grant for equipment to establish a unique deposition and characterization station for a wide range of metal-halide perovskite materials that will allow control, with high precision, of thin-film deposition from solution in a controlled atmosphere, and enable characterization of the produced films during film formation as well as in device assemblies.